SiC Power Module Packaging Using Printed Electronics Materials and Processes

Riadh Al-Haidari,Dylan Richmond,Abdullah Obeidat,Mohammed Alhendi,El Mehdi Abbara,Udara S. Somarathna,Mark Poliks,Arun V. Gowda, Jeff Erlbaum, Han Xiong,Collin Hitchcock

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY（2024）

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Key words

Silicon carbide,Multichip modules,Printing,Stress,Testing,Dielectrics,Substrates,Additive manufacturing,contact resistance,low-profile interconnections,power electronics,printed electronics,silicon carbide (SiC)

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