A Solid-State Pulsed Power Generator with Chip-on-Board Packaging SiC-Based Switching Module
IEEE TRANSACTIONS ON PLASMA SCIENCE（2024）
Key words
Inductance,Packaging,Generators,Inductors,Capacitors,Silicon carbide,MOSFET,Blumlein pulse forming network (BPFN),chip-on-board (COB),pulsed power,silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET)
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