Low-temperature Thermal Shock Simulation and Life Aging Test of Indium Flip-chip Interconnection Using Liquid Helium for Superconducting Integrated Circuit Package
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT（2024）
关键词
Flip-chip interconnection,Indium bumps,Cryogenic thermal shock,Superconducting integrated circuits,Liquid helium
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