Experimental and Modeling Analysis on Mechanical Performance of Wafer-Level Micro-Sized SnAg Solder Bump
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT（2024）
关键词
solder bump,bump shear test,shear strength,SPH-FEM coupled method
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要