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Challenges and Opportunities in Engineering Next-Generation 3D Microelectronic Devices: Improved Performance and Higher Integration Density.

Niharika Singh, Kingshuk Srivastava,Ajay Kumar,Neha Yadav,Ashish Yadav,Santosh Dubey,Rajesh Singh,Anita Gehlot,Ajay Singh Verma,Neha Gupta,Tanuj Kumar,Yongling Wu,Zheng Hongyu,Aniruddha Mondal,Kailash Pandey,Ranjeet Brajpuriya,Shalendra Kumar,Rajeev Gupta

Nanoscale Advances（2024）

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