Research on Transmission Characteristics of Tapered Through Silicon Via in Signal Integrity

Haining Yang, Yinji Cai, Qian Xu, Xiangxiang Wang, Na Li,Yujian Cheng

2024 IEEE International Symposium on Antennas and Propagation and INC/USNC‐URSI Radio Science Meeting (AP-S/INC-USNC-URSI)（2024）

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Key words

Silicon,Integration Of Signals,Signal Transmission,Increase In Height,Transmission Loss,High Frequency Band,Conductive Substrate,Thickness Of The Dielectric Layer,High Frequency Structure Simulator,Simulation Results,Geometric Parameters,Transmission Coefficient,Radius Of Influence,3D Integration

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