Simulations of Thermocouple Measurements During Reactive Bonding Processes on LTCC Substrates
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)（2024）
Key words
LTCC,RMS,reactive multilayer system,Al/Ni,temperature/voltage assessment
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined