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Thermal Conductivity of WC: Microstructural Design Driven by First-Principles Simulations

Samuel A. Humphry-Baker,Thomas A. Mellan, Mike Finnis,Peter Polcik,William E. Lee,Mike Reece,Salvatore Grasso

ACTA MATERIALIA（2025）

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Key words
Tungsten carbide,Thermal conductivity,Porosity,Grain size,Anisotropy
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