Deep Learning-Based Partial Inductance Extraction of 3-D Interconnects

Xiaofan Jia,Mingyu Wang,Qiqi Dai,Chao-Fu Wang,Abdulkadir C. Yucel

IEEE JOURNAL ON MULTISCALE AND MULTIPHYSICS COMPUTATIONAL TECHNIQUES（2025）

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Inductance,Skin,Geometry,Integrated circuit interconnections,Accuracy,Computer architecture,Capacitance,Three-dimensional displays,Current density,Standards,Convolutional neural network (CNN),deep learning,inductance extraction,machine learning,magneto-quasi-static analysis,parameter extraction,U-Net

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