Hyper RDL (HRDL) Interposer by Layer Transfer Technology for 3D IC and Advanced Packaging
2024 IEEE International Electron Devices Meeting (IEDM)（2024）
关键词
Advanced Software,Transfer Layer,Integrated Circuits Packaging,Redistribution Layer,Multilayer Stack,Heterogeneous Integration,Thermal Budget,Scanning Electron Microscopy,High Conductivity,Bond Strength,High Electrical Conductivity,High Thermal Conductivity,Passivation Layer,Need For Processing,Memory Component,Sacrificial Layer
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