AI-Accelerated Atoms-to-Circuits Thermal Simulation Pipeline for Integrated Circuit Design

Alexander J. Gabourie, Carlos A. Polanco,Connor J. McClellan, Haotian Su,Mohamadali Malakoutian,Çağil Köroğlu,Srabanti Chowdhury,Davide Donadio,Eric Pop

2024 IEEE International Electron Devices Meeting (IEDM)（2024）

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Circuit Design,Thermal Simulation,Integrated Circuit Design,Ab Initio,Thermal Model,Nanoscale Resolution,3D Integration,Molecular Dynamics Simulations,Thermal Properties,Thermography,Power Distribution,Thermal Properties Of Materials,AI Models,Thermal Challenge

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