Integrated Circuits Based on Two-Dimensional Materials
2024 IEEE International Electron Devices Meeting (IEDM)(2024)
关键词
Two-dimensional Materials,Integrated Circuit,2D Materials,Field-effect Transistors,Neuromorphic Computing,Growth Technique,3D Integration,Hardware Security,Optical Tomography,Graphene,Chemical Vapor Deposition,Random Generation,Inverter,Key Performance Indicators,Transition Metal Dichalcogenides,Sound Localization,Digital Circuits,Monolayer MoS2,Metal Organic Chemical Vapor Deposition,Multifunctional Devices,Physical Unclonable Functions,NOT Gate,Random Bits,Device Variation,2D Transition Metal Dichalcogenides,Circuit Schematic
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