2.2 IBM Telum II: Next Generation 5.5ghz Microprocessor with On-Die Data Processing Unit and Improved AI Accelerator

Gerald Strevig, Christopher J. Berry, Rahul M. Rao, Noam Jungmann, Michael A. Sperling, Michael J. Becht, Eduard Herkel,Matthias Pflanz, Patrick J. Meaney,Michael Romain,Mark Cichanowski, Amanda Venton,David Wolpert, Elazar Kachir, Luke Hopkins, Tim E. Bubb, Andreas Arp, Daniel Kiss, Simon Büchsenstein,Michael H. Wood, Michael Spear,Robert J. Sonnelitter,Rajiv Joshi

IEEE International Solid-State Circuits Conference（2025）

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关键词

Data Processing Unit,System Performance,Capacity Of System,Maximum Density,Core Area,High Cell Density,Ground Plane,Communication Protocol,Core Processes,Effect Of Defects,Improve System Performance,Data Cache,Small Mesh,Voltage Noise,Efficient Metal,Local Clock,L2 Cache,Key Capacity,Clock Network

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