Influence and Mechanism of Pt Micro-Alloying on the Microstructure and Service Reliability of the Sn-9Zn-0.02Al/Cu Solder Joint: Combined Experimental and Theoretical Study
Engineering Failure Analysis（2025）
Key words
Electronic engineering,Alloy,Copper/tin-based lead-free solder,Welding,Microscopic characterization and microanalysis,Degradation,Material defect,Pt micro-alloying
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined