Routable Wettable Flanks for MEMS Devices

Alex Gritti, Andrea Ratti,Mark Shaw, Kim-Sing Wong, Hung Meng Loh, Alessandra Casati, Ernesto Antilano, Alvin Soreda

2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)（2024）

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Key words

Organic Substances,Printed Circuit Board,Use Of Substrates,Surface-mounted,Side Of The Device,Optical Inspection,Automatic Inspection,Differences In Performance,Wettability,Bottom Layer,Floodplain,Delamination,Final Test,Metal Layer,Dielectric Layer,Substrate Thickness,Failure Analysis,Standard Substrate,Static Bending,Solder Joints,Test Board,Bottom Metal

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