Dynamic PMUTs Packaging Using Shape Memory Alloy

Megan Teng, Peggy Tsao,Wei Yue,Fan Xia, Peisheng He, Yande Peng,Liwei Lin

2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)（2025）

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MEMS,PMUT,ultrasound,packaging,machine learning,neural network,shape memory alloy

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