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Mushroom-Shaped Adhesive Structures with Smooth Contour Via Electrical Growth.

Yingze Li, Bo Sun, Miao Li,Hongmiao Tian, Jian Xu, Hongrong Hou, Zhijun Zhang, Dongning Gao, Wenjun Li, Hongjian Yan, Xiaoyong Ning,Jinyou Shao

ACS applied materials & interfaces（2025）

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