Impact of IP Block Placement on Solder Joint Reliability in IC Packages

Muhammad Musadiq, Willem D. van Driel, Romuald Roucou, Rene Rongen,GuoQi Zhang

2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)（2025）

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关键词

WLCSP,IP block,CTE,Equivalent plastic strain,Combined thermal cycles,Finite element Modelling

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