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Overview of Research Progress and Application Prospects of Thermal Test Chips

Lina Ju, Peng Jiang, Yu Ren,Ruiwen Liu,Yanmei Kong,Shichang Yun,Yuxin Ye,Binbin Jiao, Qixing Hao, Honglin Sun

Micromachines(2025)

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Key words
thermal/stress test,thermal test chip,JESD51-4,microsystem
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