Optimizing Polysilicon Deposition to Reduce Bump Defects in CMOS Technology

Ruida Yao, Tao Gong, Zhichao Shen,Yunyan Zhang, Dianyu Qi, Yitao Ma, Shi Anwei, Dawei Gao, Wenzhang Fang

2025 Conference of Science and Technology of Integrated Circuits (CSTIC)（2025）

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Key words

bump defect,polysilicon,LPCVD

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