Effects of Geometry and Surface Flatness on Direct Wafer Bonding by Multiphysics Modeling
2025 Conference of Science and Technology of Integrated Circuits (CSTIC)（2025）
Key words
Flat Surface,Effect Of Geometry,Multiphysics Model,Wafer Bonding,Finite Element,Surface Patterns,Wafer Surface,Increase In Depth,Circular Geometry
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