Thin 3D: an Innovative Approach to Ultra-Thin Wafer-Level Active Device Transfer Technology with Optimized Material and Thermal Solution for 3D Ic

Ting-Yu Chen, Shie-Ping Chang, Bo-Jheng Shih, Zih-Yang Chen, Yu-Lun Liu, Po-Jung Sung, Nein-Chih Lin,Chih-Chao Yang,Po-Tsang Huang, Ming-Yang Li, Iuliana P. Radu,Kuan-Neng Chen

2025 IEEE 75th Electronic Components and Technology Conference (ECTC)（2025）

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3D integration,ultra-thin active device transfer,layer transfer,wafer-to-wafer bonding,thermal dissipation,AIN

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