Design, Fabrication, and Calibration of Stress Sensors Embedded in a TSV Interposer in a 300mm Wafer
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)（2012）
关键词
calibration,electroplating,piezoresistive devices,semiconductor device metallisation,silicon compounds,stress measurement,three-dimensional integrated circuits,3D integration,SiO2,TSV interposer,calibration,deposition,electroplating,interposer wafers,metallization,piezoresistive stress sensors,size 300 mm,through silicon via,wafer thinning
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