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Process Development and Material Characteristics of TSV-Less Interconnection Technology for FOWLP

Wen-Wei Shen,Yu-Min Lin,Hsiang-Hung Chang,Tzu-Ying Kuo,Huan-Chun Fu,Yuan-Chang Lee,Shu-Man Lee,Ang-Ying Lin,Shin-Yi Huang,Tao-Chih Chang,Alvin Lee,Jay Su,Baron Huang,Dongshun Bai,Xiao Liu,Kuan-Neng Chen

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)（2017）

引用 9|浏览38
关键词
Fan-out wafer level packaging,FO-WLP,TSV-less interconnection
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