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Integration of Low-k Low Temperature 400°C SiCO As Offset Spacer in View of 3D Sequential Integration

C. Fenouillet-Beranger,L. Brunet, E. Arnoux,V. Lu,V. Beugin,C. Guerin, S.Del Medico,V. Loup,M.-P. Samson,B. Previtali,C. Tabone,N. Rambal,N. Rochat,D. Benoit,F. Allain,G. Romano, T. Artemisia,M. Casse,X. Garros,H. Dansas,A. Grenier,P. Batude,M. Vinet

Extended Abstracts of the 2018 International Conference on Solid State Devices and Materials（2018）

Cited 24|Views7
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