Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)(2022)
Key words
Underfills,FCBGA package Model,Ansys,DMA,Dynamic mechanical properties,Glass transition temperature,Isothermal Aging,WLF equation,TTS superposition,Prony fitting
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