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Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)(2022)

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Key words
Underfills,FCBGA package Model,Ansys,DMA,Dynamic mechanical properties,Glass transition temperature,Isothermal Aging,WLF equation,TTS superposition,Prony fitting
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