Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced Process Nodes

R. Kasim,C. Lin,C. Perini,J. Palmer, N. Gilda, S. Imam, J. R. Weber, C. Wallace,J. Hicks

2023 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS（2023）

Cited 1|Views3

Key words

component,Interconnect dielectric Reliability,Middle of Line Reliability,low-k reliability,low-k TDDB

AI Read Science

Must-Reading Tree

Example

Generate MRT to find the research sequence of this paper

Chat Paper

Summary is being generated by the instructions you defined