Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability under High-Temperature Operation
PROCEEDINGS OF ASME 2022 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2022（2022）
关键词
DMA,Underfill,WLF equation,TTS analysis,Shift factor,Relaxation modulus,Prony series constants
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要