Roadmap and Challenges on the Next Generation of Thermal Interface Material for High Warpage Heterogonies Package
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)（2022）
Key words
baseline FCBGA package,bond line thickness,coefficient of thermal expansion,digital image correlation,heat spreader,high warpage heterogonies package,high-power density silicon,IC packages,intrinsic characteristics,mechanical behavior,next generation,Si/int,system-level interaction,temperature 20.0 degC,temperature 50.0 degC to 100.0 degC,thermal behavior,thermal conductivity,thermal contact,thermal contact resistance,thermal design solutions,thermal interface material,thermal interface resistance,thermal management innovation,thermal management solution,thermal performance,TIM delamination,TIM material
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