3D FO Package Technology Using Bridge Die for High Number of Chiplets Integration

Jiaming Zhuang, Shangxuan Li, X. C. Zhang, Ivan Chen, Bruce Chen, Simon Hsieh, Bohan Yang,C. Key Chung, Xin Xia

2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT（2023）

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HPC,3D stacking packaging,Si bridge die,Chip first,Chip last,Through mold via,FOED

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