Physics-Based Assessment of Interface Fracture in FCBGAs under Sustained Humidity and Temperature Exposure
2025 Pan Pacific Strategic Electronics Symposium (Pan Pacific)（2025）
Key words
Underfill Materials,Paris Law,Isothermal Exposure,Underfill/Chip Interface,FCBGA,Delamination,Bi-Material Fracture,Interfacial Fracture Toughness,Thermal Aging
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