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Correlation Between Electronic Structure, Microstructure, and Switching Mode in Valence Change Mechanism Al2O3/TiOx‐Based Memristive Devices

ADVANCED ELECTRONIC MATERIALS(2023)

Forschungszentrum Julich | Helmholtz Zentrum Mat & Energie GmbH

Cited 4|Views23
Abstract
Abstract Memristive devices with valence change mechanism (VCM) show promise for neuromorphic data processing, although emulation of synaptic behavior with analog weight updates remains a challenge. Standard filamentary and area‐dependent resistive switching exhibit characteristic differences in the transition from the high to low resistance state, which is either abrupt with inherently high variability or gradual and allows quasi‐analog operation. In this study, the two switching modes are clearly correlated to differences in the microstructure and electronic structure for Pt/Al2O3/TiOx/Cr/Pt devices made from amorphous layers of 1.2 nm Al2O3 and 7 nm TiOx by atomic layer deposition. For the filamentary mode, operando spectromicroscopy experiments identify a localized region of ≈50 nm in diameter of reduced titania surrounded by crystalline rutile‐like TiO2, highlighting the importance of Joule heating for this mode. In contrast, both oxide layers remain in their amorphous state for the interfacial mode, which proves that device temperature during switching stays below 670 K, which is the TiO2 crystallization temperature. The analysis of the electronic conduction behavior confirms that the interfacial switching occurs by modulating the effective tunnel barrier width due to accumulation and depletion of oxygen vacancies at the Al2O3/TiOx interface. The results are transferable to other bilayer stacks.
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analog,digital,electron energy loss spectroscopy,electronic conduction mechanism,memristors,ReRAM,transmission X-ray microscopy
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要点】:本研究探讨了Al2O3/TiOx基忆阻器的电子结构、微结构及其开关模式之间的关联,揭示了不同开关模式的机制。

方法】:采用原子层沉积技术制备了Pt/Al2O3/TiOx/Cr/Pt结构,通过操作光谱显微术识别了不同开关模式下的微观结构变化。

实验】:在实验中,对两种开关模式进行了区分,一种是直径约50 nm的还原钛氧化物区域周围的锐钛矿样TiO2的丝状模式,另一种是保持非晶态的界面模式,使用的数据集为操作光谱显微术获得的实验数据,结果显示丝状模式下的设备温度高于670 K,而界面模式下的设备温度低于此温度。